Organizing Committee

General Chairs:

  • Davide Bertozzi, University of Ferrara (Italy)
  • Luca Benini, University of Bologna (Italy)

Technical Program Chairs:

  • Sudhakar Yalamanchili, Georgia Institute of Technology (USA)
  • Joerg Henkel, Karlsruhe Institute of Technology (Germany)

Publications Chair:

  • Carlo Galuzzi (Delft University of Technology, The Netherlands)

Publicity Chair:

  • Maurizio Palesi (KORE University, Italy)

Finance Chair:

  • Graziano Pravadelli (University of Verona, Italy)
  • Franco Fummi (University of Verona, Italy)

Special sessions, Tutorial and Demo Chair:

  • Paul Gratz (Texas A&M University, USA)

Industrial Chair:

  • Riccardo Locatelli (STMicroelectronics, France)

Web Chairs:

  • Andrea Bartolini (University of Bologna, Italy)
  • Marco Balboni (University of Ferrara, Italy)

Local Arrangements Chair:

  • Marco Balboni (University of Ferrara, Italy)

Technical Program Committee

  • Jung Ho Ahn, Seoul National University (Korea)
  • Lorena Anghel, TIMA (France)
  • Federico Angiolini, iNoCs (Switzerland)
  • Luca Carloni, Columbia University (USA)
  • Masoud Daneshtalab, University of Turku (Finland)
  • Petru Eles, Linkoping University (Sweden)
  • Josè Flich, Universidad Politecnica de Valencia (Spain)
  • Siddharth Garg, University of Waterloo (Canada)
  • Kees Goossens, Eindhoven University of Technology (Netherlands)
  • Paul Gratz, Texas A&M University (USA)
  • Andreas Hansson, ARM Ltd (UK)
  • Joerg Henkel, Karlsruhe Institute of Technology (Germany)
  • Shaahin Hessabi, Sharif University of Technology (Iran)
  • Riccardo Locatelli, STMicroelectronics (France)
  • Zhonghai Lu, KTH Royal Institute of Technology (Sweden)
  • Fernando Moraes, PUCRS University (Brasil)
  • Vijaykrishnan Narayanan, Penn State University (USA)
  • Nicola Nicolici, McMaster University (Canada)
  • Steven Nowick, Columbia University (USA)
  • Maurizio Palesi, KORE University (Italy)
  • Cristina Silvano, Politecnico di Milano (Italy)
  • Partha Pande, Washington State University (USA)
  • Mohammad Abdullah Al Faruque, University of California Irvine (USA)
  • James C. Hoe, Carnegie Mellon University (USA)
  • Jun Yang, University of Pittsburgh (USA)
  • Ajay Joshi, Boston University (USA)
  • Serag Gadelrab, Qualcomm, Canada
  • Jiang Xu, Hong Kong Univ. of Science and Technology (Hong Kong)
  • Gabriela Nicolescu, Polytechnique Montreal (Canada)
  • John Kim, KAIST (Korea)
  • Fabien Clermidy, CEA-LETI (France)
  • Axel Jantsch, KTH Royal Institute of Technology (Sweden)
  • Martin Radetzki, University of Stuttgart, Germany
  • Jens Sparsoe, DTU (Denmark)
  • Natalie Enright Jerger,University of Toronto (Canada)
  • Reetu Das, University of Michigan (USA)
  • Azad Naeemi, Georgia Institute of Technology (USA)
  • Holger Frög, University of Heidelberg (Germany)
  • Akhilesh Kumar, Intel (USA)
  • Ahmed Louri, University of Arizona (USA)
  • Li-Shiuan Peh, MIT (USA)
  • Umit Ogras, Intel (USA)
  • Paul Franzon, North Carolina State University (USA)
  • Sri Parameswaran, University of New South Wales (Australia)
  • Muhannad Bakir, Georgia Institute of Technology (USA)
  • Keren Bergman, Columbia University (USA)
  • Anand Raghunathan, Purdue University (USA)
  • RaduMarculescu, Carnegie Mellon University (USA)
  • Avinoam Kolodny, Technion (Israel)
  • Igor Loi, University of Bologna (Italy)
  • Vassos Soteriou, Cyprus University of Technology (Cyprus)
  • Alex Yakovlev, Newcastle University (UK)
  • Jürgen Teich, University of Erlangen-Nuremberg (Germany)
  • Partha Kundu, Juniper Networks (USA)
  • Sudhakar Yalamanchili, Georgia Institute of Technology (USA)
  • Bin Li, Juniper Networks (USA)
  • Diana Marculescu, Carnegie Mellon University (USA)
  • Karam Chatha, Arizona State University (USA)
  • Mike Kishinevsky, Intel (USA)